Company Overview:
Orbit and Skyline India Pvt. Ltd. is a leading semiconductor service provider with a robust and experienced team of professionals proficient in providing our customers with unique, feature-rich solutions that help them build environmentally friendly semiconductor manufacturing.
At Orbit & Skyline, we deliver a wide range of innovation and value to the semiconductor industry, with services ranging from mechanical, electrical, and software engineering services for our OEM clients to provisioning a Quality Management System, Supply Chain Management, and Product Lifecycle Management for our semiconductor customers. We enable our customers to develop technologies and systems that alter industries by employing one of the most diverse workforces of cutting-edge engineers and technologists in the semiconductor industry.
Our clientele includes prestigious IC chip manufacturers and OEMs from the United States, Asia, the Middle East, and Europe with our services being rendered to our global customers out of our head office in Mohali, India. We have offices in the United States, the Middle East, Singapore, Taiwan, Ireland, and several other locations.
Roles & Responsibilities:
- Packaging Problem Assessment (RCCA): Effectively identifying and solving packaging issues.
- Packaging Documentation: Creating clear and comprehensive records for packaging materials and processes.
- Engineering Change Releases: Implementing approved changes in packaging design and processes.
- Packaging Concepts (From Designing to Implementation): Developing and executing packaging ideas from start to finish.
- Process Documentation: Recording and documenting packaging procedures for consistency and improvement.
- Engaging with Suppliers for Packaging Designs: Collaborating with suppliers to create efficient and effective packaging solutions.
Maintaining Supplier Problem Records: Keeping a record of packaging-related issues with suppliers for future reference and improvement.
Eligibility Criteria:
You are where our search ends if you hold:
- 1-4 years of relevant experience.
- B. Tech (Mechanical) with Post Graduate Diploma in Packaging from IIP.
- Good knowledge of various packaging materials (preferably: Wooden Crates, Corrugated Fiberboard & Plastics).
- Qualitative Factors that make you fit for the team:
- Industrial Packaging/ Crating design experience.
- International Shipping and Packaging Experience.
- Hands-on experience in Auto-CAD or Artios CAD or NX.
- Problem-solving and Adaptability.
- Good oral and written communication skills.
- Good analytical and critical thinking skills.
Good to have: - Knowledge of Email management in Outlook, MS Excel, MS PowerPoint, and MS Teams.
- NX-CAD, Creo.
- Understanding the voice of the customer (VOC).
